High performance gap filler.
Fujipoly thermal pad 17w mk.
Self adhesive elastic adaptable.
With a 11 0 watt mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well.
With up to 17 w mk pads surpass all previously seen thermal pads and pastes.
17w mk 2 measured by using hot disk method refer to fujipoly test method ftm p 1612.
This item fujipoly ultra extreme system builder thermal pad mosfet block 100 x 15 x 1 0 thermal conductivity 17 0 w mk thermal grizzly kryonaut thermal paste 1g fujipoly mod smart ultra extreme xr m thermal pad 60 x 50 x 1 5 thermal conductivity 17 0 w mk.
Very high thermal conductivity gap filler pad 8 00.
Measured by using hot wire method refer to fujiply test method ftm p 1620.
The best thermal pads are 17w mk.
I have the fujipoly alphacool but i have only tested the alphacool on r9 nano which set the highest benchmark in superposition for a r9 nano.
So now practically all hardware components can be easily and cleanly covered with ice.
Very high thermal.
These are custom cut to a smaller more applicable size.
General purpose gap filler pad ul94 v 0 v 1 class.
General purpose gap filler pad ul94 v 0 class.
Not frozen water but a sensational new thermal pad.
The alphacool eisschicht offers all the benefits and features of a typical thermal pads.
Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.
We operate a global network of 9 manufacturing and distribution centers to deliver you unprecedented product performance and dependability.
Fujipoly sarcon xr m thermal pad high thermal conductivity of 17 0w m k sticky fujipoly is a us based company that makes high performance thermal interface materials elastomeric connectors and custom silicone extrusions.
Rubber type and 1.
Buy alphacool eisschicht thermal pad 17w mk.
High thermal conductivity gap filler pad 4 50.
Alphacool eisschicht 17 w mk silicone compound with double sticky surfaces and thermal conductivity of xr m material is 17 0w m k by using ghp 11 0w m k by using hot disk constructions recommended application thermal resistance water heat sink pcb thermal gap filler pad compression force 0 5mmt 1 0mmt 1 5mmt.
