With a 11 0 watt mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well.
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Thermal impedance of semiconductor mounted to substrate is appreciably increased at junction of porous surfaces.
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These are custom cut to a smaller more applicable size.
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The putty like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete.
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It is ideally suited for applications requiring low compression force on the component.
Thermal impedance of semiconductor mounted to substrate with gap filler pad is eliminated yielding higher temperature gradient.
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The extreme thermal pad is a ready to use high end thermal pad.
Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.
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As shown above even the most highly polished mating surfaces do not make reliable contact surfaces.
This line of thermal pads are much more effective than stock pads.
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